(1).png){kind=logo}
Русский язык
بالعربية
Türkçe 
Português
ภาษาไทย
Deutsch 
한어
Français
简体中文
日本語- Manufacturer：
-
- CUI Devices (3)
- Ohmite (4)
- Attachment Method：
-
- Material：
-
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Product Status：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
12 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | EXTRUDED HEATSIN... |
|
656
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-3 PWR... |
|
353
In-stock
|
Buy Now Get Quote | ||
|
|
Wakefield Thermal | HEATSINK TO-3 HOR... |
|
323
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,230
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,118
In-stock
|
Buy Now Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
999
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
142
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
35,000
In-stock
|
Buy Now Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
-
|
35,000
In-stock
|
Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR MET... |
-
|
35,000
In-stock
|
Get Quote |
